6AG1193-4CG30-2AA0

Technical Features:

Product Description:

SIMATIC ET 200S is a modularly scalable, distributed I/O system that is specially designed for installation in small control boxes near the machine. The modules can either be plugged directly into an ET 200S IM with CPU functionality or connected to a central controller via PROFINET or PROFIBUS. SIMATIC ET 200S can be expanded with up to 64 I/O modules, which can be inserted in any combination. The system provides a comprehensive range of modules. Many modules are also available with a wide variety of characteristics, which considerably improve the scalability in regard to functionality and price. Thus, in addition to modules with standard functions (ST), modules with an extended range of functions and diagnostics (HF High Feature/ HS High Speed) are also available. The advantage of the ET 200S system is in its ease of application, such as through the capability of swapping modules and terminal boxes during operation. The availability and productivity of the machine are considerably increased due to the so-called "hot swapping". The conformal coating protects SIPLUS extreme modules from special environmental influences such as biologically, chemically and physically active substances. Thus even your basic automation system is prepared for use in challenging environments.

Commercial Benefits:

• • Product Name: SIPLUS ET 200S TM-E30C44-01
  • Based on: 6ES7193-4CG30-0AA0
  • Conformal Coating: Yes
  • Temperature Range: -40…+70 °C
  • Overall Width: 30 mm
  • Terminal Type: Spring-loaded terminals
  • Terminal Connections: 4x 4 terminal connections
  • Terminal Access to AUX1: No
  • Modular and Scalable Design
  • Easy Installation in Small Control Boxes
  • Flexible Connectivity Options (PROFINET or PROFIBUS)
  • Up to 64 I/O Modules
  • Wide Range of Module Options
  • Improved Scalability in Functionality and Price
  • Swappable Modules and Terminal Boxes
  • Increased Machine Availability and Productivity
  • Conformal Coating for Protection in Challenging Environments

Additional Information